1 1 ratio general properties 100 solids two component silver filled epoxy with a soft smooth thixotropic becoming less viscous when stirred or shaken consistency designed specifically for chip bonding in microelectronic and optoelectronic applications. Epo tek h20e technical data sheet for reference only electrically conductive silver epoxy number of components. Epo tek h20e is a two component 100 solids silver filled epoxy paste designed specifically for chip bonding in microelectronic and optoelectronic applications.
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