Fast cure 2 component room temperature curable thermally conductive potting material.
Silicone thermally conductive encapsulant.
Thermally conductive silicone encapsulant.
Thermally conductive silicone adhesives momentive performance materials developed its family of silcool thermally conductive adhesives to help deliver thin bond lines which contribute to low thermal resistance while providing excellent adhesion and reliability.
The practice of using silicone in encapsulating and potting electronic components is a well established process designed to protect delicate circuitry.
Lord cooltherm sc 6703 thermally conductive silicone encapsulant is a two component system designed to provide thermal conductivity for encapsulating densely packed power units.
Good thermal conductivity 0 7 w m k low viscosity 4000cps.
They also provide protection from harsh environments vibration and thermal shock.
Tia208r has the unique benefit of providing primerless adhesion when cured at both elevated heat or at room temperature to not only metallic substrates but to also.
Dowsil cn 8760 thermally conductive encapsulant please contact dow for distribution options available for this product.
Primerless adhesion to metals and plastics.
Unable to complete action likely due to connectivity to dow s back end service.
Home thermally conductive silcool tia208r thermally conductive silicone encapsulant.
Thermally conductive encapsulant designed for fast fill rates and reworkability with moderate thermal conductivity gray 3 200 addition cure.
Lord cooltherm sc 324 thermally conductive silicone encapsulant is a two component system designed to provide excellent thermal conductivity for electrical electronic encapsulating applications while retaining desirable properties associated with silicones.